Metrology Process Engineer (CD-SEM) at Intel Corporation

Intel Corporation, Hillsboro, USA. | Nov, 2021 - August, 2025

Owned imaging system performance, sensor analytics, and measurement stability for advanced CD-SEM metrology equipment in high-volume semiconductor manufacturing. Drove cross-functional engineering investigations spanning hardware, software, and process integration to improve fleet-wide gauge capability, reduce measurement drift, and shift the team from reactive troubleshooting toward data-driven, proactive maintenance.

• Developed and deployed a Python-based image quality analysis pipeline applying multiple IQA algorithms (sharpness, CNR, FFT high-frequency energy, GLCM) to characterize SEM imaging sensor performance and resolve a recurring measurement drift issue that had been managed reactively for over 3–4 years — transitioning a team of 5 engineers from reactive troubleshooting to proactive, data-driven maintenance.
• Managed fleet-wide gauge capability and measurement stability through SPC, automated calibration logic, and GR&R studies to sustain Cp/Cpk targets and minimize measurement drift across advanced process nodes.
• Independently developed and deployed the workgroup's first long-term SPC trend monitoring pipeline using SQLPathfinder and Python — enabling fleet-wide longitudinal visibility into metrology performance and cutting data processing time by 80%.
• Performed structured root cause investigations on electron-optical drift and imaging anomalies; coordinated corrective actions across hardware, software, and process integration teams.

Graduate Research Scholar

University of California, Merced, California. | Aug, 2016 - Oct, 2021

PhD research at the intersection of optical physics, computational electromagnetics, and experimental metrology — focused on light–matter interactions in plasmonic nano-structures and nanoscale energy transfer.

• Developed a hybrid full-wave electromagnetic modeling framework combining the Method of Fundamental Solutions (MFS) and Foldy–Lax multiple-scattering theory to simulate scattering from dielectric cores coated with plasmonic nanoparticle assemblies.
• Implemented Python and MATLAB solvers to compute far-field scattering, extinction spectra, anisotropy, and albedo across large parameter spaces; identified regimes of scattering suppression, angular redistribution, and broadband cloaking.
• Nano-fabricated core–shell plasmonic structures and validated simulation predictions against experimental scattering measurements, with strong agreement across visible and near-IR wavelengths.
• Published in JOSA A and Optics Express; foundational to my current interest in surrogate modeling, physics-informed learning, and data-driven methods for imaging and wave-based systems.

• Designed, built, and qualified a custom high-stability TRPL optical measurement system optimized for dilute samples and weak emitters; defined specifications, aligned optical components, and developed calibration protocols.
• Probed non-radiative energy transfer in DNA-templated gold nanoclusters using time-resolved photoluminescence to distinguish FRET-type from NSET-type transfer mechanisms across 5–17 nm separations.
• Mentored undergraduate researchers and contributed data to multiple CCBM projects.

Graduate Research Associate

Universal Instruments Corporation, Conklin, New York. | 2013-2014

• Characterized thermomechanical properties of lead-tin-silver alloys for high-temperature electronic packaging.
• Conducted DSC analysis to determine melting point depression and thermodynamic behavior.
• Performed SEM-based microstructural analysis to link material composition with grain morphology.
• Measured mechanical integrity using a Dage 4000 Plus bond tester and co-authored an IMAPS industry publication.
• Co-authored an industry-facing publication for the International Microelectronics Assembly and Packaging Society (IMAPS), presenting findings to aid in the development of new industrial alloys.